Content
❙ Specifications of Yamaha Chip Mounter
| M20 | |
|---|---|
| Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,480 x W510mm*1 |
| Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L540 x W510mm |
| Board thickness | 0.4 - 4.8mm |
| Board flow direction | Left to right (Std) |
| Board transfer speed | Max 900mm/sec |
| Placement speed (4 heads + 1 theta) Opt. Cond. | 0.15sec/CHIP (24,000CPH) |
| Placement speed (4 heads + 4 theta) Opt. Cond. | 0.15sec/CHIP (24,000CPH) |
| Placement speed (6 heads + 2 theta) Opt. Cond. | 0.12sec/CHIP (30,000CPH)*2 |
| Placement speed (4 heads + 1 theta) IPC9850 | 19,000CPH |
| Placement speed (4 heads + 4 theta) IPC9850 | 19,000CPH |
| Placement speed (6 heads + 2 theta) IPC9850 | 23,000CPH*2 |
| Placement accuracy A (μ+3σ) | CHIP +/-0.040mm |
| Placement accuracy B (μ+3σ) | IC +/-0.025mm |
| Placement angle | +/-180 degrees |
| Z axis control | AC servo motor |
| Theta axis control | AC servo motor |
| Component height | Max 30mm*3 (Pre-placed components: max 25mm) |
| Applicable components | 0402 to 120x90mm, BGA, CSP, connector, etc. |
| Component package | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
| Drawback check | Vacuum check and vision check |
| Screen language | English, Chinese, Korean, Japanese |
| Board positioning | Board grip unit, front reference, auto conveyor width adjustment |
| Component types | Max 144 types (8mm tape), 36 lanes x 4 |
| Transfer height | 900 +/- 20mm |
| Machine dimensions, weight | L1750xD1750xH1420mm, Approx. 1450kg |
| Power |
3-phase 200/208/220/240/380/400/416/440V +/-10% (Transformer included), 50/60Hz |
| Max consumption, capacity | 1.1kW, 5.9kVA |
| Air pressure, consumption | 0.45Mpa, 50(4 heads) or 75(6 heads) L/min A.N.R. |
*1 Max. 950mm for 6-head configuration
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