Yamaha 3D Hybrid AOI System YRi-V
From: Author: Publish time:2021-09-07 10:15 Clicks:0
Market Background and Product Outline
The reliability shown with SMT processes directly affects the market value of the products. The SMT field in recent years has seen the shift toward smaller sizes, higher densities, greater functionality and more diversification accelerate rapidly, and in order to ensure the reliability of PCBs, fast yet precise inspection of mounting quality across all items via automated optical inspection (AOI) will be even more sought after. Also more recently, the use of thin and extremely small WLCSPs and FOWLPs,*1 which have specular gloss on the package surface, has risen significantly in the market. So, in addition to mirror-surface components that are difficult to inspect, the need for compatibility to mount ultra-small components at fine pitch is increasing.
The YRi-V accommodates these changes and demands of the market early on. This AOI system dramatically improves inspection ability in terms of both speed and accuracy, with greater detection capability for 0201 size (0.25 mm x 0.125 mm) ultra-small components and mirror-glossed components.
In addition, with our unique 1-Stop Smart Solution concept, we take advantage of being the industry’s leading manufacturer with a full lineup of SMT equipment— from SMD storage, solder paste printers and glue dispensers to surface mounters and AOIs—to offer new value via the high-level integration and coordination among our line equipment that removes the need for black boxes.
*1 WLCSP = Wafer Level Chip Size Package FOWLP = Fan Out Wafer Level Package
Basic Specifications
| Model Name | YRi-V | |
|---|---|---|
| Applicable Circuit Board Dimensions |
Single lane: L610 mm x W610 mm (max.) to L50 mm x W50 mm (min.) *L1,200 mm PCB compatibility (optional) |
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Dual-lane: L610 mm x W320 mm (max.) to L50 mm x W50 mm (max.) |
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| Resolution | Visible light (Red/Green/Blue) and infrared light 12 µm/7 µm/5 µm (selection) | |
| Inspection target |
Status of components after mounting Status of components and soldering after curing |
|
| Power Supply | Three-phase 200/208/220/230/240V/400/416V ± 10% 50/60 Hz | |
| Air Supply | 0.4 MPa or more, clean and dry | |
| External Dimensions | L1,252 mm x W1,497 mm x H1,615 mm (excluding protrusions) | |
| Weight | Approx. 1,480 kg | |
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