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Yamaha Motor i-Cube10 (YRH10) Hybrid Placer (Releases New)

From:    Author:    Publish time:2021-09-07 09:56    Clicks:0

Market Background and Product Outline

At the worksites for mounting electronic components and semiconductor packages in recent years, the trends of making things smaller and thinner, lowering power consumption, achieving higher functionality, and greater diversification are accelerating rapidly, and the implementation of even more delicate processes is progressing. In turn, the market is now looking not only for higher mounting accuracy than ever before, but also improved productivity, which directly influences packaging costs.

The newly developed i-Cube10 (YRH10) represents the first redesign in 14 years—since 2007—and is a swift response to the above changes and demands in the market, achieving a 50% improvement over previous models in both mounting accuracy and productivity. With the ability to mount various types of components such as surface mount devices and wafer components with a single unit, we aim to further bolster our sales in the electronic component and semiconductor package markets.

With our unique 1-Stop Smart Solution concept, we take advantage of being the industry’s leading manufacturer with a full lineup of SMT equipment—from SMD storage, solder paste printers and glue dispensers to surface mounters and AOIs—and to create smarter factories, we will offer new value via the high-level integration and coordination among our line equipment that removes the need for black boxes.

Basic Specifications

Model Name YRH10
Applicable Circuit Board Dimensions L50 × W30 mm (min.)–L330 × W250 mm (max.)
Applicable Circuit Board Thickness 0.1–4.0 mm
Board Transfer Direction Left → Right (Optional: Right → Left)
Conveyor Standard Front side (Custom order: rear side)
Mounting Accuracy Under Yamaha Motor optimum conditions: ±15 μm (μ+3σ)
Mounting Capability Under Yamaha Motor optimum conditions: 10,800 CPH (when supplying wafers)
Components Supply Form 6–8-inch wafer, tape reel
Applicable Components
Minimum size:
□0.35 mm (when supplying wafers)
Maximum size:
Scan camera □12 mm H6.5 mm
Multi-camera □16 mm H15 mm
Power Supply 3-phase AC 200/208/220/240/380/400/416V ±10% 50/60 Hz
Air Supply 0.45 MPa or more, clean and dry
External Dimensions L1,252 mm × W1,962 mm × H1,853 mm
Weight Approx. 1,560 kg

 

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