Content
led light shooter
Advanced Packaging Mass Reflow
PCB assembly meets Backend die placements. With actual passive shooting speeds of up to 121,000 passives per hour and flip chip shooting up to 27,000 flip chips per hour at placement defect rates lower than 1 defect per million, the Hybrid solutions gives you the best of both worlds.
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Wafer Level Packaging (WLP)
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Bonding Flip Chips and/or Passives onto wafers or panels
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Processing wafers sizes up to 12" and larger
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Cam-X and Secs-Gem compatible
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Feeding from wafer, waffle pack, tray or tape and reel
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Full controlled Placement force for thin Flip Chips or low profile passives
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Full traceability
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Fine pitch Copper Pillar Bumps
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MCM & SIP/FC BGA/FC-CSP/
FC-Memory/FCOB
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Up to 27,000 cph (IPC) Flip Chip bonding speeds
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Up to 121,000 cph (IPC) Chip shooting speeds
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High quality pick and placement process
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7 Micron for Flips Chips, Die and Wafer Level Packages
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Full controlled Placement force for thin Flip Chips or low profile passives
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Feeding from wafer, waffle pack, tray or tape and reel
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POP (Package-on-Package)
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Die or BGA stacking at the highest throughput on smallest footprint
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Feeding from wafer, waffle pack, tray or tape and reel
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Full force control with every Placement at all placement height
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Easy to exchange linear flux unit
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