Content
1200mm led pick and place machine S10
- Ultimate Flexibility to realize 3D MID* Placement
- Enhancement to 3D MID
- Large board handling capability
- Wide ranging component handling capability and high feeder capacity
- Ultimate flexibility and fast & easy setup
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Specifications
S10 Board size(with buffer unused) Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) Board size(with input or output buffer used) Min. L50 x W30mm to Max. L420 x W510mm Board size(with input and output buffers used) Min. L50 x W30mm to Max. L330 x W510mm Board thickness 0.4 - 4.8mm Board flow direction Left to right (Std) Board transfer speed Max 900mm/sec Placement speed (12 heads + 2 theta) Opt. Cond. 0.08sec/CHIP (45,000CPH) Placement accuracy A (μ+3σ) CHIP +/-0.040mm Placement accuracy B (μ+3σ) IC +/-0.025mm Placement angle +/-180 degrees Z axis control / Theta axis control AC servo motor Component height Max 30mm*1 (Pre-placed components: max 25mm) Applicable components 0201 (mm) – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) Component package 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray Drawback check Vacuum check and vision check Screen language English, Chinese, Korean, Japanese Board positioning Board grip unit, front reference, auto conveyor width adjustment Component types Max 90 types (8mm tape), 45 lanes x 2 Transfer height 900 +/- 20mm Machine dimensions, weight L1250xD1750xH1420mm, Approx. 1,200kg