High-Speed & High-Accuracy Flip Chip Bonder YSB55w YAMAHA
From: Author: Publish time:2021-09-06 13:39 Clicks:0
High-Speed & High-Accuracy Flip Chip Bonder YSB55w Overview
High bonding accuracy and x3 productivity of conventional machines! This brings a New Era in Semiconductor packaging for the expanding flip chip market.
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Function and Feature
High-Speed. 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH
Multi-die supply
Wafer feed unit
High rigidity frame & beam
