Hybrid Placer i-Cube10 Overview

Yamaha proprietary hybrid placer, best suitable for module device, that consists of semiconductor and SMD.

Hybrid mounting
Realize mixed mounting of semiconductor and SMD
High-speed and high-accuracy mounting
±15μm(Cpk≧1.0) CPH10,800(when die is supplied from wafer) Note: under optimum conditions
Upgraded component supply
Intelligent feeder
Handling Large PCBs
L330 x W250mm

Specifications

		i-Cube10 (YRH10)
Applicable PCB		L50 x W30mm to L330 x W250mm
PCB thickness		0.1 to 4.0mm
PCB conveyance direction		Left ⇒ Right (option : Right ⇒ Left)
Conveyer reference		Front
Mounting accuracy (Cpk≧1.0)		±15μm
Mounting capability		10,800 CPH (when die is supplied from wafer) Note : under optimum conditions
Number of component types		Reel : Max. 48 types (conversion for 8mm tape feeder) Wafer : Max. 10 types
Die	Die size	□0.35 to □16mm Note
	Die thickness	0.1 to 0.5mm Note
	Wafer size	6 to 8 inch wafers, 2 to 4 inch waffle trays
	Wafer magazine	Wafer : Max. 10 types
SMD	Component size	0201 to □16mm, H15mm (multi camera) 0201 to □12mm, H6.5mm (scan camera)
	Tape size	8 to 104mm
	Max feeder count	Max. 48 types (for 8mm feeder)
Power supply		3-phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz
Air supply source		0.45 MPa or more, in clean, dry state
External dimension		L1,252 x W1,962 x H1,853mm
Weight		Approx. 1,560kg

Note : The minimum size should be checked on an actual machine.

Specifications and appearance are subject to change without prior notice.

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