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YAMAHA SMT 3D Hybrid Modular S10

From:    Author:    Publish time:2021-09-02 16:30    Clicks:0

3D Hybrid Modular S10/S20 Specifications, External dimension

Ultimate Flexibility to realize 3D MID Placement

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Specifications

  S10 S20
Board size(with buffer unused) Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455)
Board size(with input or output buffer used) Min. L50 x W30mm to Max. L420 x W510mm -
Board size(with input and output buffers used) Min. L50 x W30mm to Max. L330 x W510mm Min. L50 x W30mm to Max. L540 x W510mm
Board thickness 0.4 - 4.8mm 0.4 - 4.8mm
Board flow direction Left to right (Std) Left to right (Std)
Board transfer speed Max 900mm/sec Max 900mm/sec
Placement speed (12 heads + 2 theta) Opt. Cond. 0.08sec/CHIP (45,000CPH) 0.08sec/CHIP (45,000CPH)
Placement accuracy A (μ+3σ) CHIP +/-0.040mm CHIP +/-0.040mm
Placement accuracy B (μ+3σ) IC +/-0.025mm IC +/-0.025mm
Placement angle +/-180 degrees +/-180 degrees
Z axis control / Theta axis control AC servo motor AC servo motor
Component height Max 30mm*1 (Pre-placed components: max 25mm) Max 30mm*1 (Pre-placed components: max 25mm)
Applicable components 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -)
Component package 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray
Drawback check Vacuum check and vision check Vacuum check and vision check
Screen language English, Chinese, Korean, Japanese English, Chinese, Korean, Japanese
Board positioning Board grip unit, front reference, auto conveyor width adjustment Board grip unit, front reference, auto conveyor width adjustment
Component types Max 90 types (8mm tape), 45 lanes x 2 Max 180 types (8mm tape), 45 lanes x 4
Transfer height 900 +/- 20mm 900 +/- 20mm
Machine dimensions, weight L1250xD1750xH1420mm, Approx. 1,200kg L1750xD1750xH1420mm, Approx. 1,500kg
*1 :
Board thickness + Component height = Max 30mm
Specifications and appearance are subject to change without prior notice.

External dimension

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