Component Requirements for Yamaha Surface Mounter

 

Yamaha‘s pick and place machine solutions helped many customers solve placement problems. Yamaha pick and place machine, Yamaha chip shooter, Yamaha surface Mmunter with high reliability.

 

The components of the Yamaha high-speed pick and place machine mainly include: rectangular chip components, cylindrical chip components, composite chip components, and special-shaped chip components. Surface mount devices mainly include: SMD semiconductor devices such as two tubes, transistors, and integrated circuits. The requirements of chip mounters for chip components are as follows:

1. The shape of the components is standard, which is easy to locate and suitable for automated assembly.

2. Component size standards. The dimensional accuracy of SMD components should match the dimensional accuracy of surface assembly technology and surface assembly structure so that they can be interchanged.

3. The electrical performance of the components needs to meet the standardization requirements, and the repeatability and stability are good. Its mechanical strength should meet the process requirements of the assembly technology and the performance requirements of the assembly structure.

4. The heat resistance of the materials in the components should be able to withstand the temperature impact of the welding process, and it is not easy to burn out. The surface chemistry can withstand washing by organic solutions.

5. The location and material properties of the external terminals of the components should be conducive to the automated welding process, and the external structure is suitable for tape packaging, and the model or parameters are easy to identify.

Yamaha high-speed surface mounter has YSM10, YSM20, YSM40, YS24, YS12 and other models. Those who need it can choose the pick and place machine that suits them.

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