Market Background and Product Outline
With the increase in the number of electronic components mounted in automobiles and the spread and diversification of smartphones, embedded electronic components are becoming ever-more compact, high density, diverse, and diverse in functionality. The increased adoption of ultra-compact components and narrow-pitch electrode components in response to these trends has driven significant increases in the difficulty of the process of solder paste printing onto printed circuit boards, and this process has become the most critical aspect determining the quality of the overall mounting process.
At the same time, labor shortages have led to a rapid increase in demands to reduce the labor requirements of production sites. That is to say, the work involved in backup pin and stencil frame changeover not only occupies a large portion of the labor time in printing processes, but also - due to the increased difficulty of printing - requires a high level of skill.
In response, the new premium printer YSP10 was developed to deliver high-accuracy and high-quality printing performance and accelerated cycle time as well as functionality to fully automate production changeover work. The reduction in labor requirements and cycle time also reduces the possibility of human error by reducing the need for skilled operators, contributing to improved productivity and quality.
To date, Yamaha Motor has provided solutions which increase total line efficiency and quality by leveraging its strength as a full line-up manufacturer of production equipment including SMD storage systems, surface mounters, solder paste printers, dispensers, and testing systems. Yamaha will continue to enhance the interoperability of devices, and, through linkages with the Intelligent Factory IoT/M2M integration system, which enables centralized management to move from the standalone machine to the manufacturing line, overall factory, and even the whole-company level, will comprehensively increase the efficiency and quality of mounting processes.
Basic Specifications
|
Model |
YSP10 |
|
Applicable Circuit Board Dimensions |
L510 x W510mm - L50 x W50mm
(Optional: L610 x W510mm) |
|
Print Head |
3S (Swing Single Squeegee) Head
(Optional: Double Squeegee Head) |
|
Printing Accuracy |
Repeatable Positioning Accuracy (6σ): ±0.01mm |
|
Printing Cycle Time |
10 seconds (standard printing: Yamaha Motor's optimum conditions, including circuit board conveyance time and printing time)
12 seconds (including cleaning: Yamaha Motor's optimum conditions, including circuit board conveyance time and printing time) |
|
Compatible Stencil Frame Sizes |
L750 x W750mm
L736 x W736mm (29”)
L750 x W650mm
L650 x W550mm
L584 x W584mm (23”) |
|
Power Supply |
Single-phase AC 200–230V ±20V |
|
Air Supply |
0.45 MPa or more, clean and dry state |
|
External Dimensions (excluding protrusions) |
L1,640 x W1,990 x H 1,525mm (including all options) |
|
Weight |
Approx. 1,700kg |
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