YSP10: New Features

1) Compatible with Full Automation of Production Changeover Work

◎Automatic push-up pin exchange function (optional)
Push-up pins, which support circuit boards from below, are changed over automatically. The pins are free-location models which use magnets, and suit the shape, pattern, and lower surface mounting state of the printed circuit boards, enabling positioning at the optimal location of the user’s discretion.
In addition, the dual suction heads enable simultaneous suction and placement of pins, reducing changeover time.

◎Automatic stencil replacement function (optional)
The stencil to be used in the next production batch is preset while the printer is operating, and the production changeover work is carried out automatically. The space-saving design provides for both the setting and collection of new and used stencil at the rear of the machine. The operator can conduct setup in advance when they are free, without stopping the printer, therefore enabling reduction in the time required for replacement.
The squeegee head has also been fitted with a new solder catch plate, preventing solder from dropping onto the stencil during replacement.
In addition, the one-touch stencil frame size switching mechanism enables simple changing to a range of stencil frame sizes without using tools.

◎Automatic solder transfer function (optional)
During stencil replacement, solder remaining on used stencil is automatically scoop up without waste, and is promptly transferred onto the new stencil after replacement. This not only reduces the amount of solder disposed of, but - thanks to re-using the solder from before stencil replacement - solder rolling work before starting the next model is no longer necessary.
Through use together with the automatic stencil replacement function, time lost and human error in production changeover switching are significantly reduced.

2) Cycle Time Including Stencil Cleaning Improved by 20% Compared to Previous Models

Reduction of the circuit board conveyance time through revision of the drive system etc. and motion sequence optimization has achieved a cycle time including stencil cleaning of 12 seconds, the world’s fastest level (under Yamaha Motor's optimum conditions; 10 seconds in regular printing). This 20% speed increase compared to previous models delivers higher productivity.

3) Compatibility with Wider Range of Circuit Board Sizes

The range of compatible circuit board sizes has been expanded from the previous L510 x W460mm to L510 x W510mm. Compatibility with large concentrated circuit boards (which bring together multiple circuit boards into one), lighting circuit boards for large LCD panels, or large industrial boards etc. has been expanded. In addition, compatibility with extra-large circuit boards of L610 x W510mm is available as an option.

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