3D High-speed Solder Paste Inspection Machine YSi-SP Specifications, External dimension
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Specifications
YSi-SP
Applicable PCB
L510×W460mm～L50×W50mm (single lane spec)
*No dual lane specification available.
Horizontal resolution (FOV size)
1）25µm / 12.5µm (approx. 50×50mm)
2）20µm / 10µm (approx. 40×40mm)
3）15µm / 7.5µm (approx. 30×30mm)
*All are standard selection type.
Height resolution
1µm
Inspection items
Solder paste printing quality (volume, height, area and misalignment)
Power supply
Single-phase AC 200V–230V ±10%
Air supply source
Airless specification
External dimension
L904×W1,080×H1,478 mm
Weight
Approx. 550 kg
External dimension
