3D Hybrid Modular S10/S20 Feature
Ultimate Flexibility to realize 3D MID Placement
Dispense heads that can be exchanged with mount heads are newly developed. It becomes possible to make 3D placement where solder paste dispensing and component mounting can be alternately performed. Hybrid placement is now realized. The removable Dot Station can be fitted to the feeder bank.
Newly developed models for which dispense and placement not only on standard PCB but also on concave-convex, tilting and curved surface are also to be realized. To ensure the machine for 3D MID applications such as automotive, medical and telecommunications in future, machine structures required have already been arranged accordingly.
Utilizing a laser sensor to measure the board length, providing optimum board position for efficient component placement, regardless of size or shape, for various production styles.
S20 : S20 Max. 180 types (8mm tape conversion), 45 lanes x 4
S10 : S10 Max. 90 types (8mm tape conversion), 45 lanes x 2
Nozzle ID automatically recognized. The standard ANC station can accommodate 24 nozzles. As a variation, an optional ANC station that can accommodate 40 nozzles is also available.
0201mm ultra-tiny chip (option) up to max. 120 x 90mm components can be handled by a single standard camera. Max. component height is 30mm (component height + board thickness), the greatest class on the market.
Great upgrades in fiducial recognition performance! These include colorizing for fiducial recognition cameras and a newly developed lighting unit. Robust coating inspections are now a reality. (To be customized)
Newly developed for higher speed placement is best suited for a long board production such as LED lighting.
The 6-axis 2-theta head ideal for hybrid mounting tasks achieves the ultimate 1-head solution for mounters covering the process from dispensing to mounting to inspection.
The newly developed CFB-45E as well as the existing CFB’s and CTF can be all used together on the M10 and M20 as well as on the S10 and S20.
※Fitted to S20 on the pictures below.
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3D hybrid placement functions
Enhancement to 3D MID
3D MID mounting (*Custom-order specification)
Large board handling capability
Multi-Conveyor system
Long board handling capability
With buffer unused
With input or output buffer used
With input and output buffers used
S10 board size
Max. L955 x W510mm（standard）
Max. L420 x W510mm
Max. L330 x W510mm
S20 board size
Max. L1,455 x W510mm（standard）
Max. L540 x W510mm
Wide ranging component handling capability and high feeder capacity
Max. feeder capacity 180 lanes
ANC station
Wide ranging component handling capability
Color fiducial camera
New head unit for higher speed placement
12-axis 2-theta head unit
6-axis 2-theta head unit
Ultimate flexibility and fast & easy setup
CFB/CTF full compatibility
Applicable CFB and CTF
