Yamaha S20 Pick and Place Machine
Products description
Ultimate Flexibility to realize 3D MID Placement
· Enhancement to 3D MID
· Large board handling capability
· Wide ranging component handling capability and high feeder capacity
· Ultimate flexibility and fast & easy setup
3D MID: Molded Interconnect Device
Specifications
|
S20 |
|
|
Board size(with buffer unused) |
Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) |
|
Board size(with input and output buffers used) |
Min. L50 x W30mm to Max. L540 x W510mm |
|
Board thickness |
0.4 - 4.8mm |
|
Board flow direction |
Left to right (Std) |
|
Board transfer speed |
Max 900mm/sec |
|
Placement speed (12 heads + 2 theta) Opt. Cond. |
0.08sec/CHIP (45,000CPH) |
|
Placement accuracy A |
CHIP +/-0.040mm |
|
Placement accuracy B |
IC +/-0.025mm |
|
Placement angle |
+/-180 degrees |
|
Z axis control / Theta axis control |
AC servo motor |
|
Component height |
Max 30mm*1 (Pre-placed components: max 25mm) |
|
Applicable components |
0201 (mm) – 120x90mm, BGA, CSP, connector, etc. (Standard 01005) |
|
Component package |
8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
|
Drawback check |
Vacuum check and vision check |
|
Screen language |
English, Chinese, Korean, Japanese |
|
Board positioning |
Board grip unit, front reference, auto conveyor width adjustment |
|
Component types |
Max 180 types (8mm tape), 45 lanes x 4 |
|
Transfer height |
900 +/- 20mm |
|
Machine dimensions, weight |
L1750xD1750xH1420mm, Approx. 1,500kg |
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