YAMAHA Pick and Place Machine 当前位置: Home >>News>>YAMAHA SMT
High-Speed & High-Accuracy Flip Chip Bonder YSB55w YAMAHA

High-Speed & High-Accuracy Flip Chip Bonder YSB55w Overview

High bonding accuracy and x3 productivity of conventional machines! This brings a New Era in Semiconductor packaging for the expanding flip chip market.

High-Speed & High-Accuracy Flip Chip Bonder YSB55w
High-Speed & High-Accuracy Flip Chip Bonder YSB55w
  • High bonding accuracy and x3 productivity of conventional machines!
    This brings a New Era in Semiconductor packaging for the expanding flip chip market.
  • High-Speed 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH
  • High-Accuracy ±5μm (3σ)
  • High-Quality & Flexibility
  •  
 

Function and Feature

High-Speed. 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH

Multi-die supply

Wafer feed unit

High rigidity frame & beam

 

 

LED Lamp Machine Assembly Line, LED Bulb Assembly Machine Line, SMT AutomatIC Printer, Kik Reflow Oven Profiler, Acrab 450 Wave Soldering Machine, SMT Fuji Machine, PICk And Place SMT, SMD PICk And Place Machine Fully AutomatIC, PanasonIC SMT Machin, SMT Machine Low Production, Desktop PICk And Place, MICro Robot PICk And Place, , PCBA Cleaning Machine, PCB Cleaning Machine, PCB Cleaner, Stencil Cleaning Machine, Stencil Cleaner, Machine Clean LED PCB, RobotIC Arm Screw, Inline Screw Robot, Desktop RobotIC Screw Fastening, Auto Fastening Auto-Screwdriving Machine AutomatIC Fixing Screw Robot
文章From:http://www.ledpickandplace.com/te_news_bulletin/2021-09-06/28361.chtml