Hybrid Placer i-Cube10 Overview
Yamaha proprietary hybrid placer, best suitable for module device, that consists of semiconductor and SMD.
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Hybrid mounting
Realize mixed mounting of semiconductor and SMD -
High-speed and high-accuracy mounting
±15μm(Cpk≧1.0) CPH10,800(when die is supplied from wafer) Note: under optimum conditions -
Upgraded component supply
Intelligent feeder -
Handling Large PCBs
L330 x W250mm
Specifications
| i-Cube10 (YRH10) | ||||
|---|---|---|---|---|
| Applicable PCB | L50 x W30mm to L330 x W250mm | |||
| PCB thickness | 0.1 to 4.0mm | |||
| PCB conveyance direction | Left ⇒ Right (option : Right ⇒ Left) | |||
| Conveyer reference | Front | |||
| Mounting accuracy (Cpk≧1.0) | ±15μm | |||
| Mounting capability | 10,800 CPH (when die is supplied from wafer) Note : under optimum conditions | |||
| Number of component types |
Reel : Max. 48 types (conversion for 8mm tape feeder) Wafer : Max. 10 types |
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| Die | Die size | □0.35 to □16mm Note | ||
| Die thickness | 0.1 to 0.5mm Note | |||
| Wafer size | 6 to 8 inch wafers, 2 to 4 inch waffle trays | |||
| Wafer magazine | Wafer : Max. 10 types | |||
| SMD | Component size |
0201 to □16mm, H15mm (multi camera) 0201 to □12mm, H6.5mm (scan camera) |
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| Tape size | 8 to 104mm | |||
| Max feeder count | Max. 48 types (for 8mm feeder) | |||
| Power supply | 3-phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz | |||
| Air supply source | 0.45 MPa or more, in clean, dry state | |||
| External dimension | L1,252 x W1,962 x H1,853mm | |||
| Weight | Approx. 1,560kg | |||
- Note : The minimum size should be checked on an actual machine.
- Specifications and appearance are subject to change without prior notice.
External dimension
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