3D-Xray Hybrid Inspection System YSi-X Feature
Complete renewal and updating of both hardware and image processing software has vastly improved x-ray 3D imaging and led to the advanced TypeHD/TypeHB.
This inspection checks the BGA soldering and so extracts 3D images of just the solder connection.
Void inspection performance boosted by 3D X-Ray CT image processing Enhanced void inspections mitigate effects from multilayer/back-side component, component build-in board, etc.
High accuracy information is essential for extracting image of joint surface.
(Contact us for inquiries regarding conditions and price, etc.)
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Inspection with 3D X-rays Slice Section Image
Fault layer inspection by X-ray CT
Hybrid inspections for high reliability
Equipped with 3D X-ray, 2D X-ray, Visible, Laser and Infrared
Three-color of the 3 layers → Optical inspection
Floating leads and component bodies → Laser inspection
Solder joint → 3D X-ray Inspection
PCB warping is corrected with XYZ fiducial function
Data Link with Mounter
Easily load YAMAHA mounter data and import it to inspection data
Mounter data
Makes inspection data
ECO
ECO operation capable of 3D imaging by pulse emission with minimal X-ray irradiation
X-ray source & X-ray detector material renewal fee service contracts are also available.
