3D Hybrid Modular S10/S20 Specifications, External dimension
Ultimate Flexibility to realize 3D MID Placement
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Specifications
S10
S20
Board size(with buffer unused)
Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955)
Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455)
Board size(with input or output buffer used)
Min. L50 x W30mm to Max. L420 x W510mm
-
Board size(with input and output buffers used)
Min. L50 x W30mm to Max. L330 x W510mm
Min. L50 x W30mm to Max. L540 x W510mm
Board thickness
0.4 - 4.8mm
0.4 - 4.8mm
Board flow direction
Left to right (Std)
Left to right (Std)
Board transfer speed
Max 900mm/sec
Max 900mm/sec
Placement speed (12 heads + 2 theta) Opt. Cond.
0.08sec/CHIP (45,000CPH)
0.08sec/CHIP (45,000CPH)
Placement accuracy A (μ+3σ)
CHIP +/-0.040mm
CHIP +/-0.040mm
Placement accuracy B (μ+3σ)
IC +/-0.025mm
IC +/-0.025mm
Placement angle
+/-180 degrees
+/-180 degrees
Z axis control / Theta axis control
AC servo motor
AC servo motor
Component height
Max 30mm*1 (Pre-placed components: max 25mm)
Max 30mm*1 (Pre-placed components: max 25mm)
Applicable components
0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -)
0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -)
Component package
8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray
8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray
Drawback check
Vacuum check and vision check
Vacuum check and vision check
Screen language
English, Chinese, Korean, Japanese
English, Chinese, Korean, Japanese
Board positioning
Board grip unit, front reference, auto conveyor width adjustment
Board grip unit, front reference, auto conveyor width adjustment
Component types
Max 90 types (8mm tape), 45 lanes x 2
Max 180 types (8mm tape), 45 lanes x 4
Transfer height
900 +/- 20mm
900 +/- 20mm
Machine dimensions, weight
L1250xD1750xH1420mm, Approx. 1,200kg
L1750xD1750xH1420mm, Approx. 1,500kg
External dimension
