3D-Xray Hybrid Inspection System YSi-X Specifications, External dimension
Complete renewal and updating of both hardware and image processing software has vastly improved x-ray 3D imaging and led to the advanced TypeHD/TypeHB.
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Specifications
YSi-X
Applicable PCB
Size
L100 × W50 to L560 × W460mm
Mounted components
Upper limit 40mm, lower limit 80mm (40mm during inline)
Warpage
2.0mm or less
Weight
2.0kg or less
X-ray inspection
TypeHD
TypeHB
X-ray detector
FOS flat panel system High speed type
Direct conversion panel method Long service life type
Resolution
7 to 54μm
18 to 54μm
Maximum field of view
62 × 78mm
52 × 45mm
Inspection speed 2D-X
93.7 ㎠ / sec
24.0 ㎠ / sec
Inspection speed 3D-X
15.5 ㎠ / sec
4.0 ㎠ / sec
Method
Three-dimensional fault layer inspection by X-ray CT
X-ray source
Microfocus closed tube
Tube voltage
Max. 130KV
Inspection region (PCB center section)
3D : L510 × W460 mm, 2D : L560 × W460 mm
Visible inspection
Inspection speed
0.4 sec. / field of view
Resolution
10μm / 19μm
Lighting
3-layer dome lighting, upper White(R/G/B) & infrared, mid-White(R/G/B), lower White(R/G/B)
Image capture system
5 megapixels digital color camera, telecentric lens
Inspection region
L560 × W460 mm
Laser inspection
Resolution / Method
5µm (height direction) / Triangulation distance measurement by laser spot light
Inspection region (PCB center section)
L510 × W360 mm
X-ray leakage quantity
Less than 0.2µSv/h
Power supply / Air supply source
3-phase AC 200/208/220/240/380/400/416V ±10% 50/60 Hz / 0.45MPa or more
External dimensions / Weight
L1,710 × D1,883 × H1,705mm (excluding protrusions) / Approx. 2,900kg
External dimension
